Author: Robert Bunger Schneider Electric Blog
Engineers are often called upon to think differently and solve problems. One of my favorite examples of this creative process is when the ground crew at NASA designed a CO2 removal system using only parts that were on the potentially doomed Apollo 13 spacecraft. Failure just wasn’t an option.
Under tremendous pressure, the NASA engineers came up with an ingenious strategy to get the craft back to earth safely, saving the lives of the three astronauts along for the ride.
When it comes to thinking differently, Schneider Electric and took on that mission with an integrated liquid cooling solution, leveraging. The liquid-cooled rack solution is designed to manage increased chip density; energy and water consumption; physical space and location constraints; and ever more complex data center environment and climate issues. This technology might not be as famous as cold plate or tub immersion, but it’s more adaptable to today’s needs.
A growing number of applications, including Artificial Intelligence (AI), big data analytics and data mining, require energy hungry Graphic and Central Processing Units (GPUs and CPUs). These chips are becoming increasingly power dense with thermal design power (TDP) ratings reaching 400 watts or more.
Register for the OCP Global Summit to visit our virtual booth – we’re showcasing recent enhancements to our liquid cooling solution. REGISTER >
AI is predicted to permeate practically all software applications. If that prediction is only half true, there are significant implications for data center operators who need to either host “hot chips” at scale or halt these AI-advancements. No data center manager wants to give that bad news to his or her customers; and it’s not just data center operators facing this challenge. All types of organizations are looking to collect and process data in real time at the edge, which poses additional challenges due to the types of environments where IT needs to be placed.
In the past, liquid cooling has been accused of being a solution looking for a problem, as it was marketed outside of High Performance Computing (HPC) applications. Hyperscale operators have been able to achieve incredibly low power usage effectiveness (PUE) with traditional air-cooled servers on sprawling data center campuses, but huge challenges remain and liquid cooling seem to be the most compelling use of fluids removing heat with greater energy efficiency while staying compact!
… Dirty: How to keep IT up and running on factory floors, oil rigs, distribution centers? Immersive liquid cooling by default keeps the bad stuff out and greatly enhances reliability.
… Noisy: If you have been in a data center, you know how difficult it is to hear anything or anyone. Immersive cooling keeps fans out and allows you to interact with colleagues.
… Windy: Some sterile environments can’t have air blowing around; think cleanrooms and labs. Immersive liquid cooling solves this with no fans.
Schneider Electric and Iceotope are presenting their technologies together at the virtual OCP Global Summit, from May 12 – 15. Discover the benefits of chassis-level immersion and liquid cooling technology. Click to connect with our booth of experts – they’ll be available to chat live!
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